About Us | Contact Us | Site Map Get a Quote Order Parts Contact a Sales Rep Find a Machine Spindle Repairs Home > Previously Featured Products print this page Previously Featured Products GET A QUOTE Tell us about your current project. FIND A LOCAL DISTRIBUTOR Semiconductor UPCOMING TRADESHOW Join GTI at Photonics Europe, Brussels, Belgium Tabletop Booth 413 Exhibition: 13-15 April 2010 Click here for more details. 2006 Takatori MWS 812SD Multi-Wire Saw The MWS 812SD is the newest design in the highly successful line of Takatori multi-wire saws. The larger work envelope, combined with Takatori’s patented rocking head motion, make it ideal not only for the hard material applications that Takatori has become so well known for, but also for silicon and solar silicon applications. There are several other new features that set this system apart from previous Takatori offerings: Work Envelope: 200 mm Diameter x 300 mm Length Available with 1000 m/min wire speed Optional automatic wire reversal system for diamond wire Special cutting fluid filtration system available for diamond wire usage   Takatori MWS 45   Meccanadora Line   JFP Microtechnic: Die Bonders and Scribe Units For The Microelectronic Industry JFP Microtechnic has more than 15 years of experience supplying Die Bonders and Scribe Units with rigid designs and outstanding performance. All models have been engineered for maximum accuracy and the handling of very small parts. A broad application range includes: DB-5 U/S Flip Chip Die Bonder: Engineered for ultrasonic and heavier bonding of delicate devices on substrates, with accurate placement. A flip option allows perfect alignment.   DB 1000 Flip Chip P&P Die Bonder: Achieves extremely high accuracy placement using an ultra-high magnification optical device. Scribe S200-6 and S100-3: Unique systems designed for low to medium production scribing and breaking of delicate die, clean and free from damage, in materials such as GaAs.     © Copyright 2005-2009 GTI-USA. All Rights Reserved