| ATM-1100G |
Standard Taper for 200mm Wafers |
| ATM-1100K |
Fully Automated Dry Photo-Resist Lamination |
| ATM-3000 |
Standard Taper for 300mm Wafers
|
| TEAM-100 |
for Ultra-Thin Wafers
|
| ATRM-2100 |
for Wafers Down to 200цm |
| ATRM-2200G |
for Ultra-Thin Wafers (to 100цm) |
| ATRM-4000 |
300 mm Detaper |
| TEAM-200 |
Detaper for mounted wafers |
| DM-800B |
for 50 цm Wafers |
| DM-800BP |
|
| DM-800BPR |
|
| DM-812 |
for 300 mm (12") 150цm Thickness Wafers |
| DAM-812M
(Semi-Auto) |
|
| DAM-812MP
(Semi-Auto) |
|
| DTM-812WR |
for 12" Wafers, 50цm Thickness |
| ATM-1100EF |
15-200цm Film Thickness |
| TEAM-100RF |
for Up to 150цm Thickness Wafers |
| ATM-3000EF |
for 12" (300 mm) Wafers |
| WSM-100 |
bonding |
| WSM-300 |
bonding |
| WSM-200 |
de-bonding |
| GWS-300M
|
bonding - double chamber |
| GWSM-300M |
Semi-Auto |
| GWSM-300R |
Semi-Auto |
| ATM-8100
S
|
For thin Wafers |
| ATM-8200 |
Smallest Fully Automatic Frame Mounter in the World |
| ATM-9000
(Package Mounter) |
(Package Mounter) For Mounting CSP Strips Prior to
Singulation |
| ATM-9500 |
Accomodates CSP and BGA
|
| ATM-12000 |
for 200mm and 300mm Wafers. |
| ATM-12000DR |
Includes Integrated Post-Mounting De-Tape Function |
| SAM-8
(Semi-Auto) |
Very Small Footprint |
| DTM-812WR |
For 12" Wafers, Smallest Footprint |
| TUV Series UV Irradiation |
|
| TUV-1 |
|
| TUV-12 |
|
|
|
| FTR: Frame
washing machine |
|