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JFP DB-5 Ultrasonic Flip-Chip Die Bonder

The Pick & Place DB-5 is designed for accurate placement of delicate devices on substrate. It achieves a high accuracy placement using a high magnification optical device. Flip option allows a perfect alignment of parts and substrate, mixing both video pictures. A robust, and reliable mechanical concept, designed to be external vibration free. Easy to use, flexible, the DB-5 requires only minimum training to operate.

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UPCOMING TRADESHOW

Join GTI at Semicon West, San Francisco, CA
Exhibition: 10-12 July 2012
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Wafer Specifications:
High magnification optical device Flip Option allows a perfect alignment of part and substrate, mixing both video images Horizontal or vertical ultrasonic transducer
Applications:
For Substrate up to 100 mm, Parts hold by vacuum or clamp, Substrate, Package
Contact GTI for more information