GTI Technologies, Inc. - Semiconductor - Takatori

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DAM-812M (Semi-Auto)

View the brochure in PDF format

This is semi-automatic machine for Dicing-Die bonding film (2 layers) for 8-12 inch wafer, applicable to smaller wafers too.

UPCOMING TRADESHOW

Join GTI at Semicon West, San Francisco, CA
Exhibition: 10-12 July 2012
Click here for more details.

Features:

Laminating speed control, pressure control ensures stable lamination.

Applications:

For Wafer Support System, Dicing Die bonding film (2 layers) and conventional die attach film (Single layer) by changing jig.
Applicable for ultra thin wafers less than 50microns

Contact GTI for more information