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Spindle Repairs
WSD-K2 Single/Multi Wire Saw

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This offers a single wire saw for sample wafering, wafer evaluations and low production. With the use of fixed abrasive wire, it is well-suited for edge wafer cutting, cropping and wafering in small quantities. It can also be used with up to 10 wires.
UPCOMING TRADESHOW

Join GTI at Semicon West, San Francisco, CA
Exhibition: 10-12 July 2012
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Features:
  • Well suited for sample wafering with the use of fixed abrasive wire.
  • High precision slicing achieved by high wire tensioning and Takatori-original rocking system.
  • Simple mechanical design and easy operation with the use of a touch panel control.
  • Reasonably priced for labs, low-production, and evaluation purposes.
  • Fine tuning table, theta-axis, multiple work, slicing specs, slurry process available as options.
Specifications:
  Units  
Dimensions (W x H x D) mm 1,000 x 1,750 x 1,070
Weight kg ~500
Max Work Dimensions (W x H x D) mm 156 x 156 x 100
Rocking Angle deg 0 ~ ±10
Max Wire Speed m/min 700
Max Wire Tension N 40
Contact GTI for more information